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November 1998

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Subject:
From:
John Loveluck <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 17 Nov 1998 10:53:12 -0600
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Hi

Does anyone have practical experience of the effects of thermal expansion
mismatch on a thermally conductive glueline between a silicon die (in our
case, Motorola MPC740 BGA Power PC processor) and an aluminium heatsink?

We have looked at several adhesives, some of which are much more compliant
than others, and are looking for criteria on which to base the final decision.

Thanks

John

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