Frank,
     JEDEC are the standards body for package outlines. They are in
something called publication 95. Some of the outline drawings are on free
down load at their web site (http://www.jedec.org). If not they can may
supply the drawing you want without having to buy the whole three ring
binder publication. For gull wing leads they tend to give things like foot
to foot distance, stand off, package body size that affect placement, but
leave some of the details of the lead form to the user. When you are
getting the tooling made try to have the first bend a little away from the
package body to reduce the risk of cracking the glass, or ceramic. Keep the
radii as large as you can within the spec to prevent the metal cracking.
Lead coplanarity is 4 thou maximum. +/-4 will mean some leads won't touch a
typical 6 thou solder paste deposit.

regards,  Jeremy Drake
Celestica




Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to Frank Hinojos <[log in to unmask]>



 To:      [log in to unmask]

 cc:      (bcc: Jeremy J Drake/HQ/CUK/Celestica)



 Subject: [TN] Lead bending.







     We need to design a fixture for bending leads for a metal-ceramic SMT
     package.  Where can I find spec's for bending radii, lengths, etc.?

     Also, is lead coplanarity .004" total or +/-.004".  The latter seems
     excessive.

     Thanks,

     Frank

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section
for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################