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November 1998

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Subject:
From:
Nüchter Wolfgang (FV/FLT) * <[log in to unmask]>
Reply To:
TechNet E-Mail Forum. <[log in to unmask]>
Date:
Tue, 17 Nov 1998 16:07:14 +0100
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Hi Mike,
As far as I know, you have to do a zincate treatment to get a good adhesion
between Al and Ni.
This process is not yet really a standard process available on the market,
but will be in the near future.
My purpose is to have an an wetable surface for solder in the case of
flip-chip. So try to contact Flip-Chip Technologies, IZM Berlin, Germany,
IBM, Motorola, IC Interconnect, ...
Hope this points you to the right direction.

Regards
        Wolfgang Nuechter

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