Michael,
Thanks for your comments. Just wanted to offer a clarification on some
points made.
1. I agree that high chloride does not "cause burning". It might, however,
have an impact on the degree of "burning". Please refer to my reply below.
2. Chloride effect on LCD brightness depends on the additive system used.
3. See my reply on higher Cu/lower acid effect on throwing power.
4. "Leveler" is the primary high molecular weight polymeric additive, that
controls HCD "burning" (by increasing the limiting current density) and
improves leveling through its synergistic effect with LCD brighteners.
Sometimes also referred to as "carrier", "glycol", "suppressor", "wetter"
etc.
Thanks again.
Eric Yakobson
mcarano <[log in to unmask]> on 11/14/98 08:29:00 PM
To: [log in to unmask]
cc: (bcc: Eric Yakobson/AlphaPCFabUS/Cookson)
Subject: Re: [TN] FINE LINE COPPER PLATING
Erik,
It has been my experience that higher chlorides do not cause burning or
over
plating as may be the case here. Higher than normal chlorides will reduce
the bright current density plating range by leading to dull deposits in the
low current density areas.
Raising the copper concentration of the electrolyte will lead to poor
plating distribution and throwing power. Adding a "leveler" does not
help
in this case. It may be that one of the other components of the additive
such as the carrier is low which will lead to overplating.
-----Orignal Message-----
From: Eric Yakobson <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Saturday, November 14, 1998 3:41 PM
Subject: Re: [TN] FINE LINE COPPER PLATING
>Hi Connie,
>
>My guess is that it is probably not the fine lines per se that create the
>problem, but isolated fine lines, that are in the high current density
>areas. If this is the case, you have the following options:
>
>1. Reduce plating current density.
>
>Most sensible approach (will also improve throwing power), but will
>increase the plating time.
>
>2. Increase agitation.
>
>Might work if normally it is fairly low.
>
>3. Increase copper and/or reduce sulfuric concentration.
>
>The least attractive option, will reduce throwing power.
>
>5. Increase leveler concentration.
>
>Will work only if you normally keep it on the low end of the operating
>range.
>
>6. Chloride concentration should not make a major contribution, unless it
>is out of range. Generally, at higher [Cl] the deposit would tend to
"burn"
>more readily than at lower [Cl].
>
>7. Check your anode contacts, bags, make sure your anode area and
>placement are per supplier's recommendations.
>
>I assume that you control your additives either by Hull cell or CVS and
>their concentrations are within the operating range, i.e. fully bright and
>uniform Hull cell panel with no excessive HCD "burning" or leveler
>concentration within range on CVS.
>
>Best regards.
>
>Eric Yakobson
>
>
>
>
>"Huffman Connie - LYPME" <[log in to unmask]> on 11/12/98
>09:30:30 AM
>
>To: [log in to unmask]
>cc: (bcc: Eric Yakobson/AlphaPCFabUS/Cookson)
>Subject: [TN] FINE LINE COPPER PLATING
>
>
>
>
>Hello technet,
>We are trying to plate 5 mil lines in a typical acid copper bath, and
>are experience burning and overgrowth in some areas. Should my plating
>parameters (sulfuric conc., hydrochloric conc., copper conc) change for
>finer lines? Please provide recommended parameters.
>Thanks
>cbh
>
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