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November 1998

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Subject:
From:
Greg Jones <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 16 Nov 1998 10:28:54 -0800
Content-Type:
text/plain
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text/plain (67 lines)
Alan:

You may want to look at our paper, "Introducing SPC to the Reflow Process"
(also covers Wave soldering) in the Nov. 98 issue of SMT magazine.

We will also be presenting "Applying Real-time SPC to Thermal Process
Management" at Nepcon 99.

Greg Jones
Technical Writer
KIC Thermal Profiling
-----Original Message-----
From: Alan Kreplick <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Monday, November 16, 1998 4:29 AM
Subject: [TN] SPC


>Hello Technetters:
>
>What are you doing to meet management's desire for SPC on the PWA Process -
both
>thru-hole and smt.
>
>I'm using the Wave Solder Optimizer at wave and counting the number of
misses at
>auto-insert (p-t-h), although this does not seem to be value-added.
>
>Any success stories out there.  I don't want to put a chart up just to
please
>management.
>
>
>Thanks in advance,
>
>Al Kreplick
>Sr. Mfg. Eng.
>Teradyne, Inc.
>Boston, MA 02111
>617-422-3726
>
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