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November 1998

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Subject:
From:
"Leslie O. Connally" <[log in to unmask]>
Reply To:
Leslie O. Connally
Date:
Mon, 16 Nov 1998 08:16:31 -0600
Content-Type:
text/plain
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text/plain (64 lines)
Francis,

        You are fighting a rather uphill battle, I'm not sure how you are going
to solve this with the current conditions. My advice to you is to bite the
bullet and purchase an additional power supply (rectifier), and set up a split
anode cell. You can then control the current density on each side
independently. This is nearly a must when you have gross area differences from
front to back (e.g. circuit layer/ground plane).
 I'm sorry that this doesn't resolve your current conditions. If I can help in
the wiring schematic for split anode configuration, please contact me off line.

Regards,
Les
>  From: Francis Lai <[log in to unmask]>, on 11/15/98 4:52 PM:
>  1/ Our acid copper plating bath has only one power supply. The front and
>
>     back anodes are connected to one terminal and the cathode is connected
>
>     to the other terminal. There are 3 front anodes and 3 back anodes.
>
>  2/ We have to do a pattern plating. The front side is about 3/5 of the area
>
>     of the back to be plated. We want to plate about 350 u in. of copper.
>
>     The fronnt side has a 3 mil line and tolerance is +/- 0.5 mil.
>
>     The back is the ground plane pattern.
>
>  4/ Could anyone advise how can we do it with the conditions given?
>
>  my e-mail : [log in to unmask]
>
>  Thanks a lot in advance!!!!!!!
>
>  Francis
>
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