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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 16 Nov 1998 08:24:42 -0500 |
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We have several measurement points. Some have to do with
machine or process capability (solder paste deposit thickness),
some have to do with yields (In Circuit Test, Final test,
CUSTOMER yields at THEIR Incoming visual or functional).
At all points of measurement, we pareto defects found and
document root cause and corrective action.
Jan Pelchat
Sr Quality Engineer
Benchmark Electronics
Hudson Division
______________________________ Reply Separator _________________________________
Subject: [TN] SPC
Author: Alan Kreplick <[log in to unmask]> at 0UTG0ING
Date: 11/16/98 7:16 AM
Hello Technetters:
What are you doing to meet management's desire for SPC on the PWA Process - both
thru-hole and smt.
I'm using the Wave Solder Optimizer at wave and counting the number of misses at
auto-insert (p-t-h), although this does not seem to be value-added.
Any success stories out there. I don't want to put a chart up just to please
management.
Thanks in advance,
Al Kreplick
Sr. Mfg. Eng.
Teradyne, Inc.
Boston, MA 02111
617-422-3726
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