Hello Technetters,
I'm researching some information about COG mounting process for our
process development. I have found in some articles in the net some
different mounting techniques in mounting COGs.
1. Conductive paste connection method
2. bump press-bonding method
3. Press-bonding method with conductive paste particles

Do someone here have a live experience with any one of this method or
any knowledge about this. I have read some articles that one process
for COG mounting is thru the use of Gold bump dice with ACF while
some use Stud Bump Bonding (SBB) with ICA. Where do these processes
fall, and can you kindly elaborate the differece between the three
methods and also do you know any articles or reference materials that
might help with my research. Any inputs will be appreciated. Thanks
in advanced.

Regards,
Edwin Maximo
[log in to unmask]

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