TECHNET Archives

November 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Francis Lai <[log in to unmask]>
Reply To:
Date:
Sun, 15 Nov 1998 16:52:55 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (34 lines)
1/ Our acid copper plating bath has only one power supply. The front and

   back anodes are connected to one terminal and the cathode is connected

   to the other terminal. There are 3 front anodes and 3 back anodes.

2/ We have to do a pattern plating. The front side is about 3/5 of the area

   of the back to be plated. We want to plate about 350 u in. of copper.

   The fronnt side has a 3 mil line and tolerance is +/- 0.5 mil.

   The back is the ground plane pattern.

4/ Could anyone advise how can we do it with the conditions given?

my e-mail : [log in to unmask]

Thanks a lot in advance!!!!!!!

Francis

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2