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Subject:	Re: FINE LINE COPPER PLATING
From:	mcarano <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Sat, 14 Nov 1998 12:50:01 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (52 lines)

Connie,

your plating situation will depend on the actual circuit layout and density
on your pwb. If you have many isolated traces, then you will have difficulty
with over plating. You may want to try sheilding of the anodes(to redirect
some of the current), reduce your cathode current density, increase acid
concentration, reduce copper  concentration, reduce anode area, and/or try
pulse plating.

Good luck
-----Original Message-----iel- LYPME <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Thursday, November 12, 1998 11:47 AM
Subject: [TN] FINE LINE COPPER PLATING


>Hello technet,
>We are trying to plate 5 mil lines in a typical acid copper bath, and
>are experience burning and overgrowth in some areas.  Should my plating
>parameters (sulfuric conc., hydrochloric conc., copper conc) change for
>finer lines?  Please provide recommended parameters.
>Thanks
>cbh
>
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