John:

Just a quick question about the components coming loose.  Are the component leads coming loose from the
solder loints, are the solder fillets coming loose from the pads, are the component leads breaking, or are
you experiencing a different failure mechanism?

Your answer will help determine which areas of the design need to become more roobust.

Don Vischulis
[log in to unmask]

Curtis, John wrote:

> I am looking for a comparison of (3) board types.  Advantages/Disadvantages.
> suitable applications, etc.  The (3) types are paper phenolic, CEM 1 and
> G10.  We are presently purchasing a product that uses a paper phenolic
> board.  The board has large components such as transformers and heat sinks.
> We are finding that the reliability is poor when the assembled product is
> transported due to components vibrating loose.  We are reasonably sure that
> G10 boards will help the problem.  We are not sure of the CEM 1 board
> characteristics.  If someone could help with a comparison of the three it
> would be greatly appreciated.  The operating temperature range requirement
> is 0 to 60 degrees C.
>
> Thanks,
> John Curtis
> Diebold Inc.
> North Canton, Ohio

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