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November 1998

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Subject:
From:
Eric Yakobson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 13 Nov 1998 13:46:06 -0500
Content-Type:
text/plain
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text/plain (87 lines)
Hi Connie,

My guess is that it is probably not the fine lines per se that create the
problem, but isolated fine lines, that are in the high current density
areas.  If this is the case, you have the following options:

1. Reduce plating current density.

Most sensible approach (will also improve throwing power), but will
increase the plating time.

2. Increase agitation.

Might work if normally it is fairly low.

3. Increase copper and/or reduce sulfuric concentration.

The least attractive option, will reduce throwing power.

5. Increase leveler concentration.

Will work only if you normally keep it on the low end of the operating
range.

6. Chloride concentration should not make a major contribution, unless it
is out of range. Generally, at higher [Cl] the deposit would tend to "burn"
more readily than at lower [Cl].

7.  Check your anode contacts, bags, make sure your anode area and
placement are per supplier's recommendations.

I assume that you control your additives either by Hull cell or CVS and
their concentrations are within the operating range, i.e. fully bright and
uniform Hull cell panel with no excessive HCD "burning" or leveler
concentration within range on CVS.

Best regards.

Eric Yakobson




"Huffman Connie - LYPME" <[log in to unmask]> on 11/12/98
09:30:30 AM

To:   [log in to unmask]
cc:    (bcc: Eric Yakobson/AlphaPCFabUS/Cookson)
Subject:  [TN] FINE LINE COPPER PLATING




Hello technet,
We are trying to plate 5 mil lines in a typical acid copper bath, and
are experience burning and overgrowth in some areas.  Should my plating
parameters (sulfuric conc., hydrochloric conc., copper conc) change for
finer lines?  Please provide recommended parameters.
Thanks
cbh

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