With respect to a saturated moisture sensitive device, what is the maximum
temperature (and ramp) that the device can reach before it becomes damaged
(delaminated)?  Most references just say that you shouldn't put it through
reflow. Our ovens are set to max out at 215 deg C. So, if I brought the
saturated device up to say 200 deg C (which is less than our reflow profile)
then would I damage it?  If I had to guess, I'd guess that we should be safe
as long as we're below the glass transition of the plastic.  But  If there
is a general "magic" temperature for a saturated device, is it only
important that the plastic over the die stay below this temperature, or is
it the plastic over the die and leadframe (this is important for repairs
using soldering irons or hot air pencils to touch up solder joints).
I'm not looking for a quote of an acceptable oven profile for smt devices
that are not saturated.  The reason that I'm talking about saturated devices
is with respect to PCBAs that may spend time in a debug queue that
eventually get hit with a hot air pencil to touch up solder joints.  We
don't want to send delaminated devices out the door.

And NO, I don't have a Sonoscan... although I wish I did.

Yves Trudell
Nortel, Wireless Networks Calgary
Quality System Engineering

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