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November 1998

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Subject:
Spec ref for lifted pad after assy
From:
Steve Collins <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 12 Nov 1998 13:05:57 -0700
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text/plain
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text/plain (22 lines) 
What would be the proper specification to check to when after inserting a
gold pin into a Plated through hole the pad is lifted due to stress of the
assembly method. We were using an arbor press to insert the pin and the
material is Glassteel's MC-3. I have looked at IPC-A610 and find no
reference to this situation there. How will this defect effect long term
reliability of the soldered connection. I'm worried about the knee of the
PTH cracking due to the pad lifting.

Steve Collins

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