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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 12 Nov 1998 14:49:53 -0500 |
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cbh,
The first parameter to consider changing is the total current based on the
ratio of area(5 mil lines)/area(old lines). The effects you describe seem to
be due in high current densities. I(5 mil) = I( old line) X A(5 mil)/A(old
line).
Hope thats' it.
Richard Haynes
-----Original Message-----
From: Huffman, Connie - LYPME <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Thursday, November 12, 1998 12:50 PM
Subject: [TN] FINE LINE COPPER PLATING
>Hello technet,
>We are trying to plate 5 mil lines in a typical acid copper bath, and
>are experience burning and overgrowth in some areas. Should my plating
>parameters (sulfuric conc., hydrochloric conc., copper conc) change for
>finer lines? Please provide recommended parameters.
>Thanks
>cbh
>
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