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November 1998

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Subject:
FINE LINE COPPER PLATING
From:
"Huffman, Connie - LYPME" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 12 Nov 1998 12:30:30 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (20 lines) 
Hello technet,
We are trying to plate 5 mil lines in a typical acid copper bath, and
are experience burning and overgrowth in some areas.  Should my plating
parameters (sulfuric conc., hydrochloric conc., copper conc) change for
finer lines?  Please provide recommended parameters.
Thanks
cbh

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