TECHNET Archives

November 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
copper plating
From:
[log in to unmask]
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 11 Nov 1998 20:03:20 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines) 
Moti,

there was no intention to discredit anyone - intent was to display that - with
all due respect to the other alternatives - ( additives will only take u so
far in DC mode ) - there is a better alternative - and it is viable - as
someone once wrote about DC plating -

quote :  " virtually all the plating equipment designed to accomodate the
simpler panels of the 70's n 80's is now unable to produce the same throughput
when running today's more complex boards." unquote

Richard

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2