Hello, TechNet:
Reviewing an IC component specification here, we find the plated finish of
300-800 microinches 85/15 Sn-Pb. Many other spec sheets simply call for an
Sn-Pb finish. The part in question seems to wet poorly, forming very
shallow fillets.
Can anyone confirm the typical fusible tin-lead alloy for QFP leadframes is
more like eutectic composition?
thanks,
Jerry Cupples
Interphase Corporation
Dallas, TX USA
http://www.iphase.com
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################