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November 1998

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Subject:
From:
"Vaughan, Ralph H" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 11 Nov 1998 04:55:03 -0800
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Jim,
you are obviously very well versed with IPC-D-275 and the replacement
2221/2222 documents.  Generally speaking, would you say that they are
comparable as far as requirements, with primarily format differences?  In
other words, will IPC-D-275 designs also meet 2221/2222?  I don't expect you
to chart the differences (although it would have been helpful had IPC done
so), just an idea of how much of a chore it will be to switch.

'preciate it

Ralph Vaughan
Boeing-Atlanta

> ----------
> From:         [log in to unmask][SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;[log in to unmask]
> Sent:         Tuesday, November 10, 1998 10:27 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Re SolderBalls
>
> Gary:  Electrical spacing is a design driven issue and is defined by par.
> 6.3
> and Table 6-1 on page 39 of IPC-2221 (also see conductive material
> requirements, par. 6.2 on page 35 of 2221).  Your best bet, from an
> assembly
> acceptability standpoint, is to identify the minimum spacing required in
> the
> field environment (who knows, it may be close to the "design" limit ;-)
> and
> find some visual aid that you can use to relate that value to your
> inspectors
> (diameter of a paper clip = 0.7mm [0.028 inch] and the thickness of a
> business
> card = 0.3mm [0.012 inch]).  Note that column A5 of Table 6-1 depicts a
> conductor spacing of 0.13mm [0.005 inch] for external conductors  when
> conformal coated and Column A6 depicts the same value for external
> leads/terminations which are uncoated.
> Hope this helps a little.  Regards, Jim Moffitt, Moffitt Enterprises
> Consulting
>
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