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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 10 Nov 1998 16:26:19 -0800 |
Content-Type: | text/plain |
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Terrie, I have forwarded your e-mail to our two local technical
representatives in your area. They will be contacting you to offer
assistance.
Bob Metcalf
Morton Electronic Materials
>>> Terrie Balck <[log in to unmask]> 11/09/98 12:51pm >>>
I am wondering if anyone has had any recent problems with LPI
soldermask
adhesion over reflowed tin/lead. I realize that IPC-SM-840 says that there
are adhesion problems but still gives guidelines for adhesion for types T
and H that we are not adhering to (ie more that 10% of soldermask
coming
off on tin/lead traces, after reflow). We are using Morton Epic 200. We
have studied our cleaning and surface prep as well as our curing
times/temps and we cannot seen to find anything that we are doing that
is
different. Any info/comments would be appreciated.
Terrie Black
QA Mgr. CSI
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