To all technetters:

Our design department is contemplating use of a CQ132 Ceramic Quad Flatpack.
This is a 132 lead device with 25 mil pitch leads. The part will come
supplied on a lead frame where we will program the part, then press the part
out, screen print and place, and then reflow the part.

A number of questions:

1) I have been dealing with Fancort Industries to design a die for stamping
out the Gull wing form. Are there any other companies who specialize in
forming equipment for this kind of part ?

2) Is there a correct pad geometry for this part ?? IPC spec ?? Reference ??


3) Anybody out there familiar with the proecess that I've just described ?
Hopefully theres someone out there in a "been there, done that" mode that
can give me some pointers.

4) Among the users of CQ132 QFP's, have you used your parts in a military
environment capable of meeting vibration and thermal requirements ??

5) Anybody with forming equipment out there who can tell me how easy or
difficult it was to generate a die design ?? Any advice ??

Thanks to any and all who respond. I am really up against the wall on this
one.

Bill Kasprzak
Moog Inc.
[log in to unmask]
716-652-2000 x2507

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