Can anyone assist me on the following.  Thanks.
     
     Address,
     
     This is for the asssembly houses.  When using Immersion Tin, is it 
     necessary to bring the oven temperature to the melting point of Tin 
     (232°C).  Will the Sn dissolve into the Eutectic solder deposit via 
     solderpaste deposition, if so, at what temp.  Can anyone provide 
     experiences.
     
     I am using Kester' WS851 (R596) for solderpaste.  This is a Halide 
     free paste.  Does anyone know if this is incompatible to using 
     Enthones Entek 106A OSP?  Should I be using a Halide baring paste 
     (ORM1) to remove the OSP finish?
     
     Detailed information required!!!
     
     
     Thanks.
     
     John Gulley

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