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November 1998

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Subject:
Re: Copper plating & Copper thickness
From:
Roger Mouton <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 10 Nov 1998 13:07:58 EST
Content-Type:
text/plain
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text/plain (23 lines) 
Eric -

Don't forget tertiary current distribution in your analysis of the
electrolytic cell.  In addition, far too much attention is given to the
"cathode" in these discussions without due consideration for the anode, the
other half of the cell.  There was a paper written by Jack Winters, years ago,
titled something like "The Anodes Side of The Story".  It was very revealing
and gave a balanced perspective on the electrodeposition of metals.

Roger Mouton

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