I have recently been facing a problem after reflow soldering. Almost every
chip component (approx. 60-70%) has a solder ball attached to the component
on one side between the solder joints. This ball detatches if moved with a
tweezer or something sharp.

The paste quality has been checked, reflow profile has been fine tuned and
checked, PCB has been baked to take care of any moisture entrapped. But the
problem still remains. However, after baking of the PCB the occurence of the
problem has reduced (to approx. 20-30% of chip components)

If anyone of you has ever encountered this problem and knows of a possible
cause and the solution to the same, please forward it to me.

Regards
Vinit Verma
Bharti Telecom Ltd., Gurgaon, India
Tel: +91-124-372721,22,23 (O)
        +91-11-7871747 (R)
Fax: +91-124-372724 (O)
        +91-11-5783571 (R)


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Bharti Telecom Limited, Gurgaon, India

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