TECHNET Archives

November 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Benedicto Cruz <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 10 Nov 1998 11:19:38 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (29 lines)
Hi netters,

I would like to inquire if there is a matrix that we can follow
regarding the solder paste volume requirement versus the component
size. We need this in our stencil design procedure.
This is to have an idea on the needed considerations during designing
stencils.
A quick response is high appreciated.


Jon Cruz
Supervising Product Engineer
Electronic Assemblies Inc.
[log in to unmask]
tel.# 823-7317/7593884
fax# 8238326

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2