TECHNET Archives

November 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Soldermask adhesion over tin/lead
From:
Terrie Balck <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 9 Nov 1998 12:51:56 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines) 
I am wondering if anyone has had any recent problems with LPI soldermask
adhesion over reflowed tin/lead. I realize that IPC-SM-840 says that there
are adhesion problems but still gives guidelines for adhesion for types T
and H that we are not adhering to (ie more that 10% of soldermask coming
off on tin/lead traces, after reflow). We are using Morton Epic 200. We
have studied our cleaning and surface prep as well as our curing
times/temps and we cannot seen to find anything that we are doing that is
different. Any info/comments would be appreciated.
Terrie Black
QA Mgr. CSI

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2