Address,
     
     This is for the asssembly houses.  When using Immersion Tin, is it 
     necessary to bring the oven temperature to the melting point of Tin 
     (232°C).  Will the Sn dissolve into the Eutectic solder deposit via 
     solderpaste deposition, if so, at what temp.  Can anyone provide 
     experiences.
     
     I am using Kester' WS851 (R596) for solderpaste.  This is a Halide 
     free paste.  Does anyone know if this is incompatible to using 
     Enthones Entek 106A OSP?  Should I be using a Halide baring paste 
     (ORM1) to remove the OSP finish?
     
     Detailed information required!!!
     
     
     Thanks.
     
     John Gulley

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################