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November 1998

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Subject:
From:
David D Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 20 Nov 1998 16:43:27 -0600
Content-Type:
text/plain
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Hi Kelly - I believe that you will not have any problems soldering to that
finish than those encountered when soldering to other nickel/combination
finishes. If I did the conversions correctly (I am somewhat metrically
impaired - it would be nice if the US would become metric during my
lifetime!) you have very very little Au and Pd  so the possibility of an
embrittlement issue is reasonably low. Also there are a fair number of
industry examples of  folks soldering to nickel finishes with good
reliability. Pd finishes are typically very dense with little porosity
issues - and you have the example of the Texas Instruments Pd/Ni finish
being used on a large number of component types in the electronics
industry. One area you may want to investigate is how that finish reacts
with your process flux chemistries - Pd has been shown to be somewhat flux
type sensitive. Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]





KELLY M SCHRIVER <[log in to unmask]> on 11/19/98 01:54:00 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to KELLY M SCHRIVER <[log in to unmask]>

To:   [log in to unmask]
cc:
Subject:  [TN] Ni/Pd/Au Lead Finish




Hi All -

One of our component suppliers has recently notified us that a portion of
their product line will shortly change over to a Ni/Pd/Au finish.  From
their
notification document and the testing performed to date, I really don't
expect
to encounter problems, however, I would like to ask if anyone has
experience
with this finish combination.  If so, are there any special precautions in
either handling or processing?

Specifics of the finish are:  0.5-2.0 micro meters Ni; 0.02-0.15 micro
meters
Pd; and ~30 angstroms Au flash.

Would appreciate your feedback.  Regards - Kelly

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