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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 9 Nov 1998 10:45:09 -0500 |
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Any information out there regarding immersion gold over nickel on SMT
printed wiring boards. This gives a very flat surface for fine pitch
placement. When I read in J-STD-001B in para.5.4.1 Gold Removal, that "all"
surfaces to be soldered must have the gold removed, I am assuming that means
the gold pads also. Is this the intent? Does this preclude the use of
immersion gold over nickel is out? Being a MIL house there is concern with
gold embrittlement of the solder joints.
Barrie Candeas
GTE Taunton Ma.
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