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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 6 Nov 1998 20:45:50 -0600 |
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Francis,
How long of a dwell time and at what temperature is the gold plating
solution operating at? The solutionitself is fairly aggressive on dry
film.Some companies manufacture a film just for this application.
Good luck,
-----Original Message-----
From: Francis Lai <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Friday, November 06, 1998 4:40 PM
Subject: [TN] Problem in Gold Plating
>I work in gold plating. We are using electrolytic gold plating.
>
>It is pattern plating. However the gold leaks underneath the dry film.
>
>As a result the pattern is fatter after the dry film is removed.
>
>We develop the pattern dry film and thenn hardenn the dry film by
>
>exposing under UV light again. But still it leaks underneath the dry
>
>film. Could any one help ?
>
>WE also want to set up a pulse plating bath ourselves. Could any
>
>one give us some information onn how to start ?
>
>Thanks in advance!!!!!!!!
>
>my e-mail : [log in to unmask] ( Please do not send graphics, this
> is text base)
>
>Thanks again
>
>Francis
>
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