Subject: | |
From: | |
Reply To: | Leslie O. Connally |
Date: | Fri, 6 Nov 1998 08:25:16 -0500 |
Content-Type: | text/plain |
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Hi Josh,
I'm not sure what the definition of an average inner layer etch line
is, but I can provide some information.
The parameters to track are as follows, but not limited to those alone:
1) Normality -- We run a normality of 2.6 here, but if you are looking
for a better etch factor or fine line improvement, I would suggest a
normality of 1 - This will etch slower but provide greater quality.
2) Oxidation/Reduction Potential (ORP) - for the most stable etch rate
420 to 460 millivolts.
3) Copper content - Usually controlled by Baume' or specific gravity.
This can vary somewhat but about 20g/liter or a Baume' of about 32
4) Conveyor speed - Equipment dependent
5) Etch rate or weight loss from a fixed size coupon. Evaluate top to
bottom variability.
6) Spray pressures. - again equipment Dependent (est. about 30 PSIG)
I hope this is of some help, If you want to pursue further, contact me off
line.
Regards,
Les
> From: [log in to unmask], on 11/6/98 12:33 AM:
> I'm new at cupric etching. What are the parameters for the average
> innerlayer
> etch line? What controls should I be monitoring, for example, normality,
> copper content, etc? What ranges will provide me the best process in terms
> of
> etch line quality (minimum copper foot with best possible line width
> uniformity and etch speed)? I know equipment has a lot to do with the
> results; we can't change equipment, so I'm looking to improve quality with
> chemistry.
>
> Thanks.
>
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