Larry
Page 157 of 'Mechanics of Solder Alloys - Wetting and Spreading' by DR
Frear, FG Yost and FM Hosking gives reported CuSn intermetallic growth
rates, at room temperature, of 0.3, 0.5 and a maximum of 0.8 microns per
year.
Regards
Rob
Manufacturing Technology
Celestica Limited
UK
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