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Date: | Sat, 14 Nov 1998 14:45:01 -0500 |
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1/ In our copper bath, there are 3 anodes in the front side and 3 anodes
on the back side with the panel immersing in copper sulphate agitating
between the front and back anodes. Say, if I get X mil in an hour of
copper plated.
2/ If for pattern plating, the front to be plated is only half of the area
to be plated at the backside. If I used 2 anodes in the front and 4 annodes
at the back, do I still get X mil of copper plated on both the front and
back sides of the panel?
3/ What is the theory of the ratio of anodes to cathode in copper or tin
lead plating?
4/ If the front and back side anodes are not equal, will this affect the
shape of the plated trrough hole?
Could somebody help me with this? I work in copper plating for 2 years but
I do not know the theory behind it. I am just curious to know.
Thanks in advance!!!!!!
my e-mail: [log in to unmask] (this is text base pls do not send
graphics)
Thanks again
Francis
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