Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 11 Nov 1998 04:55:03 -0800 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Jim,
you are obviously very well versed with IPC-D-275 and the replacement
2221/2222 documents. Generally speaking, would you say that they are
comparable as far as requirements, with primarily format differences? In
other words, will IPC-D-275 designs also meet 2221/2222? I don't expect you
to chart the differences (although it would have been helpful had IPC done
so), just an idea of how much of a chore it will be to switch.
'preciate it
Ralph Vaughan
Boeing-Atlanta
> ----------
> From: [log in to unmask][SMTP:[log in to unmask]]
> Reply To: TechNet E-Mail Forum.;[log in to unmask]
> Sent: Tuesday, November 10, 1998 10:27 AM
> To: [log in to unmask]
> Subject: Re: [TN] Re SolderBalls
>
> Gary: Electrical spacing is a design driven issue and is defined by par.
> 6.3
> and Table 6-1 on page 39 of IPC-2221 (also see conductive material
> requirements, par. 6.2 on page 35 of 2221). Your best bet, from an
> assembly
> acceptability standpoint, is to identify the minimum spacing required in
> the
> field environment (who knows, it may be close to the "design" limit ;-)
> and
> find some visual aid that you can use to relate that value to your
> inspectors
> (diameter of a paper clip = 0.7mm [0.028 inch] and the thickness of a
> business
> card = 0.3mm [0.012 inch]). Note that column A5 of Table 6-1 depicts a
> conductor spacing of 0.13mm [0.005 inch] for external conductors when
> conformal coated and Column A6 depicts the same value for external
> leads/terminations which are uncoated.
> Hope this helps a little. Regards, Jim Moffitt, Moffitt Enterprises
> Consulting
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in the body:
> To subscribe: SUBSCRIBE TechNet <your full name>
> To unsubscribe: SIGNOFF TechNet
> ################################################################
> Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
> section for additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or
> 847-509-9700 ext.312
> ################################################################
>
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
|
|