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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 9 Nov 1998 20:56:22 EST |
Content-Type: | text/plain |
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Jim: IPC-A-610B is not process dependent. Solder balls, whether formed
during through hole, SMT, wave solder, reflow or hand soldering are covered by
par. 4.1 on page 53 of IPC-A-610B. J-STD-001B covers solder balls with Defect
No. 16 of Table 11-1 (again, not process or technology dependent).
Hope the above helps some.
Regards, Jim Moffitt, Moffitt Enterprises Consulting
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