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From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 9 Nov 1998 14:57:47 -0600 |
Content-Type: | text/plain |
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Address,
This is for the asssembly houses. When using Immersion Tin, is it
necessary to bring the oven temperature to the melting point of Tin
(232°C). Will the Sn dissolve into the Eutectic solder deposit via
solderpaste deposition, if so, at what temp. Can anyone provide
experiences.
I am using Kester' WS851 (R596) for solderpaste. This is a Halide
free paste. Does anyone know if this is incompatible to using
Enthones Entek 106A OSP? Should I be using a Halide baring paste
(ORM1) to remove the OSP finish?
Detailed information required!!!
Thanks.
John Gulley
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