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Wed, 4 Nov 1998 12:36:19 -0500 |
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we have just begun to evaluate Ultraplate for initial hole metalization on
thin FR4 applications. Preliminary testing is very encouraging with samples
for -40C / +125C thermal cycling about to begin 1000 hrs of testing.
Adhesion of the acid copper to the nickel looks good with no evidence of
voiding or pitting.
Regards.
-----Original Message-----
From: Jac Kroeker [SMTP:[log in to unmask]]
Sent: Monday, November 02, 1998 16:44 11:05
To: [log in to unmask]
Subject: [TN] electroless pth
I am having trouble posting this message to Technet. If you have seen this
before--- please excuse.
Hi platers and assemblers:
We would like to eliminate electroless copper from our pth line. Has
anybody had any experience with Fidelity's Ultraplate 300? Good, bad or
indifferent?
Are there other better alternatives? I am aware of paladium, but I don't
find it too exciting.
Jac from the great white north eh.
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