TECHNET Archives

November 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Sender:
TechNet <[log in to unmask]>
Subject:
ENC: [TN] Re[2]: [TN] Re[2]: [TN] PCB ASSEMBLY COST ANALYSIS
From:
"(No Name Available)" <[log in to unmask]>
Date:
Fri, 20 Nov 1998 14:00:23 -0200
Content-Type:
multipart/mixed; boundary="openmail-part-015c267e-00000001"
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
Parts/Attachments:
BDY.RTF (-1 MB) , BDY.RTF (-1 MB) , WINMAIL.DAT (-1 MB)

ATOM RSS1 RSS2