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October 1998

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Subject:
From:
Matthew Park <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 6 Oct 1998 15:47:03 -0700
Content-Type:
text/plain
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text/plain (132 lines)
Hey,  don't agree with the section of IPC guideline quoted by Phil.
 IPC is becoming obolete and too conservative.  Don't you, guys
and gals heard of vertical design and integration?  Aren't we,
techies supposed to be in cutting edge of high tech revolution?

Think about how much board real estate we are saving,
the amount of signal propagation delay is reduced and etc with
vertical integration of components.

Sherman, resend that technet message with the new title "[TN]
ASSy: vertical integration of 1206 chip resistors"  Ooop,  looks
like I already done it for you

just my wacky idea

>>> Paul Klasek <[log in to unmask]> October 6, 1998
3:15 pm >>>
Hi Phil

You're right ; sounds that much more clear than J ;
looks like I didn't reed it all after all ( or forgot what I've read ) =
sorry Sherman ; at least I've made a fool of myself with a good
result
thanks to Phil .

So that's the law ; can see the tensions on bridging of space
working ;
can't see the stress (apart from thermal dissipation = must be
the
reason for stacking ban) on stacking .

Thanks Phil ; going shopping (275)

Paul Klasek
http://www.resmed.com

> ----------
> From:         Crepeau, Phil[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Crepeau, Phil
> Sent:         Wednesday, October 07, 1998 12:31 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] ASSY: stacking 1206 chip resistors
>
> hi,
>
> well, the nice thing about ansi/ipc-d-275 is that they don't
pussyfoot
> around this issue.  they must have actually had manufacturing
in mind
> when
> they wrote the following paragraph and inserted figure 4-38.
>
> '4.4.2.1 end-capped discrete components.  end-capped
discrete resistor
> and
> capacitor components, and similar leadless end-capped
discrete
> components,
> shall not be stacked, nor shall they bridge spacing between
other
> parts or
> components, such as terminals or other mounted compnents
(see figure
> 4-38).
>
> 'end-cap discrete leadless components with electrical
elements
> deposited on
> an external surface, such as chip resistors, shall be mounted
with the
> deposited surface facing away from the printed board (see
figure
> 4-39).'
>
> don't need a lawyer here do you?
>
> phil crepeau
>
> -----Original Message-----
> From: Paul Klasek [mailto:[log in to unmask]]
>
>
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