Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 5 Oct 1998 20:09:01 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
" Throwing power " is a term invented to name a phenomenon. There is usually
a disparity between the primary current distribution and the metal
distribution. The degree vary from solution to solution. It is really
considered as describing a property of a solution.
Throwing power combined with many other terms give a picture about the
ability to control the distribution of metal over the surface of the
workpieces. for PCB the surface include both panel and barrel surface. I
think you can just interprete high throwing power plating chemistry give you
more even distribution between panel surface and hole barrel.
-----Original Message-----
From: Jacob Ransborg <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Monday, October 05, 1998 6:43 PM
Subject: [TN] Throwing Power
>Hi Tech Netters
>
>I have seen different ways to define the throwing power in a Cu-plating
>process.
>Can anyone show/tell me the exact definition and explane what throwing
>power means.
>
>Regards
>Jacob Ransborg
>
>################################################################
>TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
>################################################################
>To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in the body:
>To subscribe: SUBSCRIBE TechNet <your full name>
>To unsubscribe: SIGNOFF TechNet
>################################################################
>Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section
for additional information.
>For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
>################################################################
>
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
|
|