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October 1998

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Subject:
From:
Yongheng Zhu <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 5 Oct 1998 20:09:01 -0500
Content-Type:
text/plain
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text/plain (55 lines)
" Throwing power " is a term invented to name a phenomenon. There is usually
a disparity between the primary current distribution and the metal
distribution. The degree vary from solution to solution. It is really
considered as describing a property of a solution.

Throwing power combined with many other terms give a picture about the
ability to control the distribution of metal  over the surface of the
workpieces. for PCB  the surface include both  panel and barrel surface. I
think you can just interprete high throwing power plating chemistry give you
more even distribution between panel surface and hole barrel.

-----Original Message-----
From: Jacob Ransborg <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Monday, October 05, 1998 6:43 PM
Subject: [TN] Throwing Power


>Hi Tech Netters
>
>I have seen different ways to define the throwing power in a Cu-plating
>process.
>Can anyone show/tell me the exact definition and explane what throwing
>power means.
>
>Regards
>Jacob Ransborg
>
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