TECHNET Archives

October 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
BGA Acceptable crititerial
From:
Paul Yan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 5 Oct 1998 10:56:13 -0700
Content-Type:
multipart/alternative =_NextPart_001_01BDF089.71943FAE"
Parts/Attachments:
text/plain (702 bytes) 
We are currently establishing a in-house  BGA process and have several
questions:

1) What is an acceptable amount of times a BGA device can be reworked,
reballed, and remounted?

2)  What are the critical elements to consider and why?

3)  What is the maximum number or percentage of solder voids allowed per
solder joint (bump) connection?

4) Any recommendation regarding rework equipment.

5) Has IPC released a BGA standard?  If so, can you email, fax me a copy
of the section concerning about the maximum number or percentage of
solder void allowed per solder joint..

I need the info. ASAP.

Paul Yan
LeeMah Electronics
1088 Sansome St.
SF, Ca 94111

Email - [log in to unmask]

Phone - 415-394-1288  X265
Fax -     415-394-7682

ATOM RSS1 RSS2