Can anyone suggest a reliable/cost effective method for plugging vias in a
solder coated copper multilayer polyimide board?  The different vias sizes
are approximately .010" and .015" dia. after solder plating.  They are in
ground plane areas where solder will be printed, parts placed and then sent
thru reflow at 215 C.  The part body gets soldered to the ground plane.  We
can't afford to loose an area greater than the diameter of the holes under
each part to nonconductive material.  We are trying to prevent solder loss
thru the holes to the other side of the board.  Whatever material we use
must not expand out the top of the hole to push the part up during reflow.
Thanks for any help you can give in this matter.

Bill Mengers
Process Engineer

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