Hi Rick - I have found that the palladium finishes can be "flux" specific.
Profiles, aging, and handling were not the issues but the flux activators
had a direct correlation to consistently forming good solder joints. Take a
look at your solder flux. Also Doug Romm at Texas Instruments (
[log in to unmask])  is a very good source of palladium finish information.
Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]




Rick Thompson <[log in to unmask]> on 10/02/98 09:39:12 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
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Subject:  [TN] Soldering Palladium plated leads




Hi,

With all the current discussion of solderability issues, I'm hoping some of
you may be able to apply your expertise and give me some insight into a
problem we seem to consistently have.  When soldering components with
palladium plated leads, we do not seem to get any wetting on the leads.  It
kind of looks like the 'footprint in mud' affect.  On pcb's where we have
this condition, all other components have soldered fine with good fillets
and wetting.  Checks of the oven profile indicate a good profile for the
paste we're using (Kester R598, water soluble).  Currently we've only found
this on components from TI, so I don't know if it's only their components
or
the plating in general.

Question: Are there any recommendations for profile, paste, process, etc.
that differ from 'standards' when working with these types of components?

Thanks.

                Rick Thompson
                Ventura Electronics Assembly
                2665A Park Center Dr.
                Simi Valley, CA 93065

            [log in to unmask]

                (805) 584-9858 voice
                (805) 584-1529 fax

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