Dear Sir :
I work inn a high frequency PCB manufacturing company and I have the
following questionns :
1/ Why is it for copper plating (acid copper plating) the lower the
current, the more the throwing power ? If I start to plate copper
on the PTH walls with high current density after PTH, what will
happen ?
2/ Our customer always specify to have a certainn thickness innside the
PTH walls for copper. Why is that so for high frequency PCB ?
What happen if copper thickness is thinner than the specified
thickness at high frequencies ?
Thanks for your help !!!!!!!
my e-mail : [log in to unmask](this is only text base, pls do not send
graphics)
Thamks again!!!!!!!
Francis
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