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October 1998

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Subject:
Re: Immersion Tin Process
From:
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TechNet E-Mail Forum.
Date:
Fri, 30 Oct 1998 23:08:03 -0600
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On 10/30/98 13:49:42 you wrote:
>
>I'm looking for feedback on processing PCBs manufactured with 'immersion' or
>'white' tin surface instead of HASL. In perusing the archives, I notice
>there were pro's and con's to the process a while ago and I'm wondering what
>the current thoughts of people using the process are. Any specific process
>recommendations, reliability, etc. would be appreciated.
>
>Thanks.
>
>                Rick Thompson
>                Ventura Electronics Assembly
>                2665A Park Center Dr.
>                Simi Valley, CA 93065
>
>            [log in to unmask]
>
>                (805) 584-9858 voice
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Rick,
When I worked at Sandia Labs we had a couple of DOE programs where the PWB vender used immersion
tin then shipped the boards to another vender for assembly. These boards were unsolderable.
Reason a copper tin intermetallic formed which prevented soldering by normal soldering
procedures. The boards had to be stripped of the intermetallic then re coated with solder before
assembly could be accomplished. Therefor from my experience I do not recommend the use of
immersion tin.
Good luck,
Arny Andrade
Sandia Labs (Ret.)

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