We've been asked by a customer to run boards with Intel uBGA flash memory on
both sides of the board. My first impression was that the mass of the part
vs. the ball area would not provide sufficient tension to hold the bottom
side parts in place when reflowing the top. However, the customer does not
want epoxy used to attach the bottom side parts due to shock testing they
have to perform.

Question: Anyone using these parts successfully on bottom side SMT?
Anything I should watch out for?  The components in question are 7.67mm x
16.37mm with a 56 ball array in the center. Ball width is .35mm with a .75mm
pitch.

Thanks in advance.

                Rick Thompson
                Ventura Electronics Assembly
                2665A Park Center Dr.
                Simi Valley, CA 93065

            [log in to unmask]

                (805) 584-9858 voice
                (805) 584-1529 fax

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