In a nutshell...

Usually, ceramic BGA components are used when hermetically sealed devices are
required, like for military or hi reliability applications.  You have to be
careful, though,  of thermal coefficient of expansion (TCE) mismatch between
the component and the substrate to which it is attached.  Depending upon the
environment which the assembly will be subjected to, this may or may not be a
problem.  The closer the TCE mismatch, the more reliable the solder joints will
be.

This just touches on the subject, but if you would like to discuss this in more
detail, please call.

Jim Marsico
AIL Systems Inc.
(516) 595-5879
[log in to unmask]


################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################