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October 1998

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Subject:
From:
Thomas C Han <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 29 Oct 1998 14:13:19 -0800
Content-Type:
text/plain
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text/plain (34 lines)
Hi all

I use a M.O.L.E. to profile a board thru reflow.  I take a single board,
place some components on top, attach thermal couples on the fab, a
passive pad, soic lead, Qfp lead.  The components just sit on the fab w/o
solderpaste or its intended location.  My question is

1.  Since not all the components are on the board, how accurate are the
temp readings?

2.  Should I take measurements with the first loaded board w/
solderpaste?  If so, where should I place the thermalcouples?


Tom Han
Ardent Systems

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