Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 29 Oct 1998 14:13:19 -0800 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hi all
I use a M.O.L.E. to profile a board thru reflow. I take a single board,
place some components on top, attach thermal couples on the fab, a
passive pad, soic lead, Qfp lead. The components just sit on the fab w/o
solderpaste or its intended location. My question is
1. Since not all the components are on the board, how accurate are the
temp readings?
2. Should I take measurements with the first loaded board w/
solderpaste? If so, where should I place the thermalcouples?
Tom Han
Ardent Systems
___________________________________________________________________
You don't need to buy Internet access to use free Internet e-mail.
Get completely free e-mail from Juno at http://www.juno.com/getjuno.html
or call Juno at (800) 654-JUNO [654-5866]
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
|
|