Hi all,

For SMT double-sided boards we will typically solderpaste all vias on the bottom
side for vacuum test reasons.  For a single-sided SMT board, it makes sense to
do this on the top side (costly to create another stencil just to paste vias on
the bottom side).

My question is this....we have a prototype that has several vias located beneath
some pretty low profile TSOPs, where the body is 2-8 mils off the board.  I've
come to understand that a 6-8 mil solder print is typical.  Has anyone
experienced shorting of vias beneath low profile parts due to the paste?

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