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October 1998

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Subject:
Re: Wirebonding
From:
"R. Srinivasan" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 29 Oct 1998 21:27:52 +0800
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text/plain (57 lines) 
     Hi Don Vischulis,

     One source to see the plating spec. for bonding application is
     IPC-2221(Generic Standard on Printed circuit board design).See 4.4.4
     Gold plating ...Table 4.3.It gives only the thickness requirement.

     Hope it helps..

     Regards
     R.Srini



______________________________ Reply Separator _________________________________
Subject: [TN] Wirebonding
Author:  <[log in to unmask] > at internet
Date:    10/28/98 12:55 PM


Hi all:

Can anybody tell me where I can find typical plating specifications for a
printed
board that will be used for aluminum wire bonding?  I am looking for thickness,
composition, etc of the nickel and gold plating.

Thanks in advance

Don Vischulis
[log in to unmask]

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